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The Company

Research & Development

Laboratory CAD/PCB

Printed Circuit Board Design Laboratory

The Printed Circuit Board Lab designs the physical substrate board of the electronic units manufactured by INTRACOM TELECOM. Due to product manufacturing and operational requirements, the design becomes an integral part of product-specific know-how.

The company made timely investments in electromagnetic emission simulation software aimed at timely fault identification prior to certification, resulting in fewer redesigns and accelerated development.

In recent years the Lab has been focusing on improving infrastructure organisation to reduce development time-and on designing products incorporating new materials, such as Fine Pitch QFPs, BGA, Mbga, Unpackaged Wire Bonded Dies.Moreover, preliminary activities towards upgrading the laboratory's design software were completed ; upgrades were in place during the first half of 2000, along with upgraded work-station hardware.

Printed Circuit Board Laboratory

The Printed Circuit Board Labproduces highly reliable and quick-turnover, multi-layer circuit board prototypes.

The laboratory's investment program, which includes the installation of short-run (pilot) and application-specific (for example multilayer blind vias and buried vias) board production facilities, has been successfullycompleted.

As part of its expansion to include board production for defense applications, the laboratory attained MIL-PRF-5511OF certification.